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A new equivalent circuit scheme for grounded back-to-back GCPW-MS-GCPW transitions fabricated on a thin low-k substrate

Abstract : We hereby present a new equivalent circuit model including both lumped and distributed elements for GCPW-MS transitions (GCPW for Grounded CoplanarWaveguide and MS for Microstrip). In order to validate the modelling results, such transitions have been fabricated on a 20 μm-thick BCB (Benzocyclobutene resin) substrate using grounding pads including via-holes of different diameters. The study focused on the impact of the via-hole diameter on the performance of the transition and more specifically on its bandwidth. The transitions were made using a simple technological process based on photosensitive polymer. ADS simulation data of the new equivalent circuit model were in very good agreement with measured S-parameters. Both theoretical and experimental results have shown that the bandwidth of such a transition can reach up to 100 GHz using via-holes of 900 μm diameter.
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https://hal.archives-ouvertes.fr/hal-03054270
Contributor : Sandrine Charlier Connect in order to contact the contributor
Submitted on : Friday, September 24, 2021 - 11:17:22 AM
Last modification on : Tuesday, November 22, 2022 - 2:26:16 PM

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Pierre-Vincent Dugué, Mohammed El Gibari, Mathieu Halbwax, Stephane Ginestar, Vanessa Avramovic, et al.. A new equivalent circuit scheme for grounded back-to-back GCPW-MS-GCPW transitions fabricated on a thin low-k substrate. Progress In Electromagnetics Research Letters, 2021, 95, pp.33-42. ⟨10.2528/PIERL20093003⟩. ⟨hal-03054270⟩

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