Measurement of Thermal Conductivity and Thermal Resistance Through a Tiny Hot-Plate Experiment - LEMTA - Laboratoire d'Energétique et de Mécanique Théorique et Appliquée Accéder directement au contenu
Article Dans Une Revue High Temperatures-High Pressures Année : 2009

Measurement of Thermal Conductivity and Thermal Resistance Through a Tiny Hot-Plate Experiment

Résumé

A new thermal conductivity and thermal resistance measurement method is presented. This stationary method is dedicated to heterogeneous materials and systems to which transient measurement methods cannot be applied. The experimental device is detailed and an exact heat transfer model based on integral transforms is developed. The estimation method both with the uncertainty evaluation process is presented. Experimental results obtained with materials which thermal conductivities are known validate the method. An application to the measurement of the thermal resistance of a heterogeneous material (double glazing insert) is presented.
Fichier principal
Vignette du fichier
Paper_public.pdf (452.55 Ko) Télécharger le fichier
Origine : Fichiers produits par l'(les) auteur(s)
Loading...

Dates et versions

hal-01971683 , version 1 (07-01-2019)

Identifiants

  • HAL Id : hal-01971683 , version 1

Citer

Benjamin Rémy, Yves Jannot, A. Degiovanni. Measurement of Thermal Conductivity and Thermal Resistance Through a Tiny Hot-Plate Experiment. High Temperatures-High Pressures, 2009, 39 (1), pp.11-31. ⟨hal-01971683⟩
70 Consultations
743 Téléchargements

Partager

Gmail Facebook X LinkedIn More