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Influence of thermal ageing on cyclic mechanical properties of SnAgCu alloys for microelectronic assemblies

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https://hal-ecp.archives-ouvertes.fr/hal-00761224
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Submitted on : Wednesday, December 5, 2012 - 10:33:53 AM
Last modification on : Tuesday, November 24, 2020 - 2:18:05 PM

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Benoît Dompierre, Véronique Aubin, Eric Charkaluk, Wilson Carlos Maia Filho, Michel Brizoux. Influence of thermal ageing on cyclic mechanical properties of SnAgCu alloys for microelectronic assemblies. Procedia Engineering, Elsevier, 2010, 2 (1), pp.1477-1486. ⟨10.1016/j.proeng.2010.03.159⟩. ⟨hal-00761224⟩

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