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Thermal ageing induces drastic changes on mechanical and damage behavior of Sn3.0Ag0.5Cu alloy

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https://hal-ecp.archives-ouvertes.fr/hal-00761246
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Submitted on : Wednesday, December 5, 2012 - 10:47:48 AM
Last modification on : Tuesday, November 24, 2020 - 2:18:05 PM

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Benoît Dompierre, Wilson Carlos Maia Filho, Michel Brizoux, Véronique Aubin, Eric Charkaluk. Thermal ageing induces drastic changes on mechanical and damage behavior of Sn3.0Ag0.5Cu alloy. Microelectronics Reliability, Elsevier, 2010, 50 (9-11), pp.1661-1665. ⟨10.1016/j.microrel.2010.07.125⟩. ⟨hal-00761246⟩

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